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description these precision optical performance alingap leds provide superior light output for excellent readability in sunlight and are extre m ely reliable. alingap led technology pro - vides extre m ely stable light output over long periods of ti m e. precision optical pe r for m ance la m ps utilize the alu m i - num indium gallium phos phide (alingap) technology. these led la m ps are untinted, nondifused, t-1 3 / 4 pack - ages incorporating second generation optics producing well defned spatial radiation patterns at specifc viewing cone angles. these la m ps are m ade with an advanced optical grade epoxy, ofering superior high te mper a ture and high mois - ture resistance perfor m ance in outdoor signal and sign applications. the high maximum led junction tem pera- ture li m it of +130c enables high tem perature operation in bright sunlight conditions. the package epoxy contains both uv-a and uv - b in hibitors to reduce the efects of long ter m exposure to direct sunlight. these la m ps are available in two package options to give the designer fexibility with device m ounting. benefts ? viewing angles m atch trafc m anage m ent sign require - m ents ? colors m eet autom otive and pedestrian signal speci - fcations ? superior perfor m ance in outdoor environm ents ? suitable for autoinsertion onto pc boards features ? well defned spatial radiation patterns ? viewing angles: 8, 15, 23, 30 ? high lu minous output ? colors: 590 nm amber 605 nm orange 615 nm reddish-orange 626 nm red ? high operating te m perature: t j led = +130c ? superior resistance to m oisture ? package options: with or without lead stand-ofs applications ? trafc managem ent: trafc signals pedestrian signals work zone warning lights variable m essage signs ? co mm ercial outdoor advertising: signs marquees ? auto m otive: exterior and interior lights hlmp-elxx, hlmp-ehxx, hlmp-ejxx, hlmp-egxx t-1 3 / 4 (5 mm) precision optical performance alingap led lamps data sheet
2 device selection guide typical color and dominant lamps without lamps with standofs luminous intensity viewing angle wavelength standofs on leads on leads iv (mcd) [1,2,5] @ 20 ma 2 1 / 2 (deg.) [4] (nm), typ. [3] (outline drawing a) (outline drawing b) min. max. 8 a mber 590 hlmp-el08-t0000 hlmp-el10-t0000 2500 C hlmp-el08-vy000 hlmp-el10-vy000 4200 12000 hlmp-el08-vyk00 4200 12000 hlmp-el08-wz000 hlmp-el10-wz000 5500 16000 hlmp-el08-x1k00 hlmp-el10-x1k00 7200 21000 hlmp-el08-x1000 hlmp-el10-x1000 7200 21000 orange 605 hlmp-ej08-wz000 5500 16000 hlmp-ej08-x1000 hlmp-ej10-x1000 7200 21000 hlmp-ej08-y2000 9300 27000 red-orange 615 hlmp-eh08-ux000 hlmp-eh10-ux000 3200 9300 hlmp-eh08-wz000 hlmp-eh10-wz000 5500 16000 hlmp-eh08-x1000 hlmp-eh10-x1000 7200 21000 hlmp-eh08-y2000 hlmp-eh10-y2000 9300 27000 red 626 hlmp-eg08-t0000 hlmp-eg10-t0000 2500 C hlmp-eg08-vy000 4200 12000 hlmp-eg08-wz000 hlmp-eg10-wz000 5500 16000 hlmp-eg08-x1000 hlmp-eg10-x1000 7200 21000 hlmp-eg08-yz000 9300 16000 hlmp-eg08-y2000 hlmp-eg10-y2000 9300 27000 notes: 1. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 2. the optical axis is closely aligned with the package m echanical axis. 3. the do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 4. 1/2 is the of-axis angle where the lu m inous intensity is half the on-axis intensity. 5. tolerance for each intensity bin li mit is 15%.
3 device selection guide typical color and dominant lamps without lamps with standofs luminous intensity viewing angle wavelength standofs on leads on leads iv (mcd) [1,2,5] @ 20 ma 2 1 / 2 (deg.) [4] (nm), typ. [3] (outline drawing a) (outline drawing b) min. max. 15 a mber 590 hlmp-el17-m0000 520 C hlmp-el15-ps000 880 2500 hlmp-el15-qsk00 1150 2500 hlmp-el15-qt000 1150 3200 hlmp-el15-ru000 1500 4200 hlmp-el15-tw000 hlmp-el17-tw000 2500 7200 hlmp-el15-twk00 2500 7200 hlmp-el15-ux000 hlmp-el17-ux000 3200 9300 hlmp-el15-vy000 hlmp-el17-vy000 4200 12000 hlmp-el15-vyk00 4200 12000 hlmp-el15-vw000 4200 7200 orange 605 hlmp-ej17-qt000 1150 3200 hlmp-ej15-ps000 880 2500 hlmp-ej15-ru000 1500 4200 hlmp-ej15-sv000 hlmp-ej17-sv000 1900 5500 red-orange 615 hlmp-eh15-qt000 1150 3200 hlmp-eh15-ru000 1500 4200 hlmp-eh15-tw000 hlmp-eh17-tw000 2500 7200 hlmp-eh15-ux000 hlmp-eh17-ux000 3200 9300 red 626 hlmp-eg15-n0000 hlmp-eg17-n0000 680 C hlmp-eg15-ps000 880 2500 hlmp-eg15-qt000 hlmp-eg17-qt000 1150 3200 hlmp-eg15-ru000 hlmp-eg17-ru000 1500 4200 hlmp-eg15-ux000 hlmp-eg17-ux000 3200 9300 hlmp-eg15-tw000 hlmp-eg17-tw000 2500 7200 notes: 1. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 2. the optical axis is closely aligned with the package m echanical axis. 3. the do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 4. 1/2 is the of-axis angle where the lu m inous intensity is half the on-axis intensity. 5. tolerance for each intensity bin li mit is 15%.
4 device selection guide typical color and dominant lamps without lamps with standofs luminous intensity viewing angle wavelength standofs on leads on leads iv (mcd) [1,2,5] @ 20 ma 2 1 / 2 (deg.) [4] (nm), typ. [3] (outline drawing a) (outline drawing b) min. max. 23 a mber 590 hlmp-el24-l0000 hlmp-el26-l0000 400 C hlmp-el24-mq000 520 1500 hlmp-el24-nr000 680 1900 hlmp-el24-ps000 hlmp-el26-ps000 880 2500 hlmp-el24-qr000 1150 1900 hlmp-el24-qrk00 1150 1900 hlmp-el24-qs400 1150 2500 hlmp-el24-qt000 hlmp-el26-qt000 1150 3200 hlmp-el24-ru000 hlmp-el26-ru000 1150 4200 hlmp-el24-ruk00 1150 4200 hlmp-el24-sv000 hlmp-el26-sv000 1900 5500 hlmp-el24-suk00 1900 4200 hlmp-el24-su400 1900 4200 hlmp-el24-svk00 1900 5500 hlmp-el24-tw000 hlmp-el26-tw000 2500 7200 hlmp-el24-twk00 2500 7200 orange 605 hlmp-ej24-qt000 1150 3200 red-orange 615 hlmp-eh24-ps000 hlmp-eh26-ps000 880 2500 hlmp-eh24-qt000 1150 3200 hlmp-eh24-ru000 1500 4200 hlmp-eh24-sv000 hlmp-eh26-sv000 1900 5500 red 626 hlmp-eg24-m0000 hlmp-eg26-m0000 520 C hlmp-eg24-ps000 hlmp-eg26-ps000 880 2500 hlmp-eg24-qt000 1150 4200 hlmp-eg24-ru000 hlmp-eg26-ru000 1500 4200 notes: 1. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 2. the optical axis is closely aligned with the package m echanical axis. 3. the do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 4. 1/2 is the of-axis angle where the lu m inous intensity is half the on-axis intensity. 5. tolerance for each intensity bin li mit is 15%.
5 notes: 1. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 2. the optical axis is closely aligned with the package m echanical axis. 3. the do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 4. 1/2 is the of-axis angle where the lu m inous intensity is half the on-axis intensity. 5. tolerance for each intensity bin li mit is 15%. device selection guide typical color and dominant lamps without lamps with standofs luminous intensity viewing angle wavelength standofs on leads on leads iv (mcd) [1,2,5] @ 20 ma 2 1 / 2 (deg.) [4] (nm), typ. [3] (outline drawing a) (outline drawing b) min. max. 30 a mber 590 hlmp-el30-k0000 hlmp-el32-k0000 310 C hlmp-el30-mq000 520 1500 hlmp-el32-nr000 680 1900 hlmp-el30-pq000 880 1500 hlmp-el30-pr400 880 1900 hlmp-el30-ps000 hlmp-el32-ps000 880 2500 hlmp-el30-psk00 880 2500 hlmp-el30-qt000 hlmp-el32-qt000 1150 3200 hlmp-el30-qtk00 1150 3200 hlmp-el30-st000 1900 3200 hlmp-el30-su400 1900 4200 hlmp-el30-suk00 1900 4200 hlmp-el30-stk00 1900 3200 hlmp-el30-sv000 hlmp-el32-sv000 1900 5500 hlmp-el30-svk00 1900 5500 orange 605 hlmp-ej30-nr000 680 1900 hlmp-ej30-ps000 hlmp-ej32-ps000 880 2500 red-orange 615 hlmp-eh30-mq000 hlmp-eh32-mq000 520 1500 hlmp-eh30-nr000 hlmp-eh32-nr000 680 1900 hlmp-eh30-ps000 hlmp-eh32-ps000 880 2500 hlmp-eh30-qt000 hlmp-eh32-qt000 1150 4200 hlmp-eh30-ru000 hlmp-eh32-ru000 1500 4200 red 626 hlmp-eg30-k0000 hlmp-eg32-k0000 270 C hlmp-eg30-kn000 310 880 hlmp-eg30-mq000 hlmp-eg32-mq000 520 1500 hlmp-eg30-nq000 680 1500 hlmp-eg30-nr000 hlmp-eg32-nr000 680 1900 hlmp-eg30-pq000 880 1500 hlmp-eg30-pr000 880 1900 hlmp-eg30-ps000 880 2500 hlmp-eg30-qt000 hlmp-eg32-qt000 1150 3200
6 hlmp - x x xx - x x x xx mechanical options 00: bulk packaging dd: a mm o pack yy: flexi-bin; bulk packaging zz: flexi-bin; a mm o pack color bin selections 0: no color bin li m itation 4: a m ber color bin 4 only k: a m ber color bins 2 and 4 only maximum intensity bin 0: no iv bin li m itation minimum intensity bin viewing angle & lead stand ofs 08: 8 deg without lead stand ofs 10: 8 deg with lead stand ofs 15: 15 deg without lead stand ofs 17: 15 deg with lead stand ofs 24: 23 deg without lead stand ofs 26: 23 deg with lead stand ofs 30: 30 deg without lead stand ofs 32: 30 deg with lead stand ofs color g: 626 nm red h: 615 nm red-orange j: 605 nm orange l: 590 nm a mber package e: 5 mm round part numbering system note: please refer to ab 5337 for co m plete infor m ation on part num bering system.
7 notes: 1. all dimensions are in millimeters (inches). 2. tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 3. for dome heights above lead stand-off seating plane, d, lamp package b, see table. b package dimensions a 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. notes: 1. all dimensions are in millimeters (inches). 2. leads are mild steel, solder dipped. 3. tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 4. for dome heights above lead stand-off seating plane, d, lamp package b, see table. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat d 1.50 0.15 (0.059 0.006) part no. d hlmp-xx10 12.37 0.25 (0.487 0.010) hlmp-xx17 12.42 0.25 (0.489 0.010) hlmp-xx26 12.52 0.25 (0.493 0.010) hlmp-xx32 11.96 0.25 (0.471 0.010)
8 electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions forward voltage i f = 20 ma a mber ( d = 590 nm) 2.02 orange ( d = 605 nm) v f 1.98 2.4 v red-orange ( d = 615 nm) 1.94 red ( d = 626 nm) 1.90 reverse voltage v r 5 20 v i f = 100 a peak wavelength: peak of wavelength of a mber ( d = 590 nm) 592 spectral distribution orange ( d = 605 nm) peak 609 nm at i f = 20 ma red-orange ( d = 615 nm) 621 red ( d = 626 nm) 635 spectral halfwidth ? 1/2 17 nm wavelength width at spectral distribution 1 / 2 power point at i f = 20 ma speed of response t s 20 ns exponential ti me constant, e -t/ts capacitance c 40 pf v f = 0, f = 1 mhz ther m al resistance r j-pin 240 c/w led junction-to-cathode lead lu m inous efcacy [1] em itted luminous a mber ( d = 590 nm) 480 power/e m itted radiant orange ( d = 605 nm) h v 370 lm/w power red-orange ( d = 615 nm) 260 red ( d = 626 nm) 150 lu m inous flux j v 500 mlm i f = 20 ma lu m inous efciency [2] h e em itted luminous a mber 12 lm/w flux/electrical power orange 13 red-orange 13 red 13 note: 1. the radiant intensity, i e , in watts per steradian, m ay be found from the equation i e = i v / h v , where i v is the lum inous intensity in candelas and h v is the lum inous efcacy in lum ens/watt. 2. h e = j v / i f x v f , where j v is the em itted luminous fux, i f is electrical forward current and v f is the forward voltage. absolute maximum ratings at t a = 25c dc forward current [1,2,3] ..................................................................................... 50 ma peak pulsed forward current [2,3] ....................................................................... 100 ma average forward current [3] .................................................................................. 30 ma reverse voltage (i r = 100 a) ........................................................................................ 5 v led junction te m perature ....................................................................................... 130c operating te m perature ......................................................................... -40c to +100c storage te m perature .............................................................................. -40c to +100c notes: 1. derate linearly as shown in figure 4. 2. for long ter m perfor m ance with minim al light output degradation, drive currents between 10 ma and 30 m a are recomm ended. for m ore infor m ation on recomm ended drive conditions, please refer to application brief i-024. 3. operating at currents below 1 m a is not recomm ended. please contact your local representa - tive for further infor m ation.
9 figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. maximum forward current vs. ambient temperature figure 1. relative intensity vs. peak wavelength figure 5. representative spatial radiation pattern for 8 viewing angle lamps i f ? forward current ? ma 0 0 t a ? ambient temperature ? c 40 80 50 45 35 25 15 5 55 40 30 20 10 20 60 100 120 n o r m a l i z e d i n t e n s i t y ? % 1 0 a n g u l a r d i s p l a c e m e n t ? d e g r e e s 0 . 8 0 . 6 0 . 5 0 . 7 0 . 2 0 1 . 0 . 3 0 . 4 0 . 9 - 6 0 - 3 0 0 3 0 6 0 9 0 - 9 0 wavelength ? nm relative intensity 550 600 650 700 1.0 0.5 0 amber red-orange orange red current ? ma 1.0 0 v f ? forward voltage ? v 2.5 100 40 30 1.5 2.0 60 3.0 10 20 50 red amber 70 80 90 relative luminous intensity (normalized at 20 ma) 0 0 i f ? dc forward current ? ma 40 3.0 2.0 1.5 1.0 0.5 20 60 2.5
10 figure 7. representative spatial radiation pattern for 23 viewing angle lamps figure 8. representative spatial radiation pattern for 30 viewing angle lamps figure 6. representative spatial radiation pattern for 15 viewing angle lamps n o r m a l i z e d i n t e n s i t y ? % 1 0 a n g u l a r d i s p l a c e m e n t ? d e g r e e s 0 . 8 0 . 6 0 . 5 0 . 7 0 . 2 0 . 1 0 . 3 0 . 4 0 . 9 - 5 0 0 5 0 1 0 0 - 1 0 0 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s n o r m a l i z e d i n t e n s i t y n o r m a l i z e d i n t e n s i t y ? % 1 0 a n g u l a r d i s p l a c e m e n t ? d e g r e e s 0 . 8 0 . 6 0 . 5 0 . 7 0 . 2 0 . 1 0 . 3 0 . 4 0 . 9 3 0 6 0 9 0 1 2 0 1 5 0 1 8 0 0
0.1 relative lop (normalized at 25 c) junction temperature ? c -50 10 1 -25 0 2 5 5 0 7 5 150 100 125 orange red red-orange amber bin name min. max. k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 2 21000 27000 intensity bin limits (mcd at 20 ma) bin name min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 amber color bin limits (nm at 20 ma) tolerance for each bin li mit is 0.5 nm. note: 1. bin categories are established for classif - cation of products. products m ay not be available in all bin categories. tolerance for each bin li mit is 15%. figure 9. relative light output vs. junction temperature
12 precautions: lead forming: ? the leads of an led la mp m ay be prefor m ed or cut to length prior to insertion and soldering on pc board. ? for better control, it is reco mm ended to use proper tool to precisely for m and cut the leads to applicable length rather than doing it m anually. ? if m anual lead cutting is necessary, cut the leads after the soldering process. the solder connection for m s a m echanical ground which prevents m echanical stress due to lead cutting fro m traveling into led package. this is highly reco mm ended for hand solder operation, as the excess lead length also acts as s m all heat sink. soldering and handling: ? care m ust be taken during pcb assem bly and soldering process to prevent da m age to the led com ponent. ? led co m ponent m ay be efectively hand soldered to pcb. however, it is only reco mm ended under unavoidable circu m stances such as rework. the closest m anual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm . soldering the led using soldering iron tip closer than 1.59mm m ight dam age the led. note: 1. pcb with diferent size and design (co m ponent density) will have diferent heat m ass (heat capacity). this m ight cause a change in te m perature experienced by the board if sam e wave soldering setting is used. so, it is reco mm ended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. custo m er is advised to take extra precaution during wave soldering to ensure that the maximum wave tem perature does not exceed 250c and the solder contact ti m e does not exceeding 3sec. over-stressing the led during soldering process m ight cause prem ature failure to the led due to dela m ination. avago technologies led confguration 1.59mm ? esd precaution m ust be properly applied on the soldering station and personnel to prevent esd dam age to the led com ponent that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? reco mm ended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat te m perature 105 c max. - preheat ti me 60 sec max - peak te m perature 250 c max. 260 c max. dwell ti me 3 sec max. 5 sec max note: 1) above conditions refers to m easurem ent with ther m ocouple m ounted at the bottom of pcb. 2) it is reco mm ended to use only bottom preheaters in order to reduce ther m al stress experienced by led. ? wave soldering para m eters m ust be set and m aintained according to the reco mm ended tem perature and dwell ti m e. custom er is advised to perfor m daily check on the soldering profle to ensure that it is always confor m ing to recomm ended soldering conditions. note: electrical connection between botto m surface of led die and the lead fra m e is achieved through conductive paste. ? any align m ent fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal m aterial is reco mm ended as it will absorb less heat during wave soldering process. ? at elevated te m perature, led is m ore susceptible to m echanical stress. therefore, pcb m ust allowed to cool down to roo m tem perature prior to handling, which includes re m oval of alignm ent fxture or pallet. ? if pcb board contains both through hole (th) led and other surface m ount com ponents, it is recommended that surface m ount com ponents be soldered on the top side of the pcb. if surface m ount need to be on the botto m side, these com ponents should be soldered using refow soldering prior to insertion the th led. ? reco mm ended pc board plated through holes (pth) size for led co m ponent leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. allngap device cathode
13 ammo pack drawing figure 10. recommended wave soldering profle example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. refer to application note an5334 for m ore infor m ation about soldering and handling of high brightness th led lam ps. 1 8 . 0 0 0 . 5 0 ( 0 . 7 0 8 7 0 . 0 1 9 7 ) 6 . 3 5 1 . 3 0 ( 0 . 2 5 0 . 0 5 1 2 ) 1 2 . 7 0 1 . 0 0 ( 0 . 5 0 0 . 0 3 9 4 ) 9 . 1 2 5 0 . 6 2 5 ( 0 . 3 5 9 3 0 . 0 2 4 6 ) 1 2 . 7 0 0 . 3 0 ( 0 . 5 0 0 . 0 1 1 8 ) c a t h o d e 0 . 7 0 0 . 2 0 ( 0 . 0 2 7 6 0 . 0 0 7 9 ) 2 0 . 5 0 1 . 0 0 ( 0 . 8 0 7 0 . 0 3 9 ) a a v i e w a ? a ? 4 . 0 0 0 . 2 0 ( 0 . 1 5 7 5 0 . 0 0 8 ) t y p . a l l d i m e n s i o n s i n m i l l i m e t e r s ( i n c h e s ) . n o t e : t h e a m m o - p a c k s d r a w i n g i s a p p l i c a b l e f o r p a c k a g i n g o p t i o n - d d & - z z a n d r e g a r d l e s s o f s t a n d o f f o r n o n - s t a n d o f f .
14 packaging box for ammo packs from left side of box, adhesive tape must be facing upward. avago technologies anode mother label cathode c a + ? anode lead leaves the box first. note: the dimension for ammo pack is applicable for the device with standoff and without standoff. label on this side of box. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4368en av02-0373en - september 2, 2008 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l (ii) avago baby label (only available on bulk packaging) acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part nu m ber with color bins but without vf bin or part nu m ber with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part nu m ber that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only

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